REWA technology channel has published a new video showing the process of disassembly iPhone 17 ProThis helps to carefully study the device with support for physical SIM cards.
The novelty has experienced a number of changes in design, in which the lenses increased by the main camera. The engineers have added a modern cooling system based on evaporation chamber, ensuring effective heat dispersion. For wireless communication, Apple's development is used-chip N1, supports Wi-Fi 7, Bluetooth 6 and thread standard.
An important innovation is to optimize the assembly process by increasing the number of screws (up to 14) and reducing the use of glue, helping to simplify the removal and reduce the risk of damage to internal factors. Inside the case is a huge graphene plate to increase the effectiveness of heat sink.
A special emphasis is the improvement of the camera: iPhone 17 Pro is equipped with a larger sensor in both the main chamber and front chamber. At the same time, the location of the projector and infrared sensor has been changed in the design of the selfie camera.
Improved design of the motherboard with horizontal arrangement and strengthening, according to experts, will ensure greater stability in strikes. However, experts note that the overlapping of Nand memory and the A19 processor can make it difficult to modernize data storage. In general, the device shows remarkable improvements compared to the previous version, however, the use of new types of connectors can show problems for newly started techniques.